Performance advantages of silicone resin: diversified applications from basic to high-end
Silicone resin can be divided into methyl silicone resin, phenyl silicone resin, epoxy modified silicone resin, and other types based on the R/Si ratio (the ratio of organic groups to silicon atoms) and the type of groups. The performance differences determine the application scenarios


Methyl silicone resin: with a low R/Si value (1.2-1.6) and a low curing temperature, it is suitable for basic fields such as heat-resistant coatings and release agents.
Phenyl silicone resin: high phenyl content (20% -60%), high film hardness, good heat resistance, used as high-temperature adhesive and electronic packaging adhesive.
Epoxy modified silicone resin: Crosslinked by epoxy groups to improve adhesive strength and weather resistance, used as a toughening agent for electronic packaging adhesives and coatings.
Data support: After heating at 250 ℃ for 24 hours, the weight loss of silicone resin is only 2% -8%, which is much better than that of ordinary organic resin; It has low surface tension (<0.2mN/cm), strong film-forming ability, and excellent hydrophobic and defoaming properties.