One cannot simply conclude that product mold silicone 1500-1560, which is a 1:1 two-component room-temperature curing liquid silicone with a temperature resistance of 250°C or a shrinkage rate of ≤0.1%, is suitable for all oven baking molds, high-temperature simulations, or precise replication systems. One must first confirm the A/B weight ratio, the uniformity of mixing, the vacuum degassing process, the pouring method, the material of the master mold and the mold frame, the temperature curve of the oven, and the hardness requirements of the product. Then, one can determine whether the problem is caused by a weight ratio deviation, residual bubbles, platinum catalyst poisoning, or an unsuitable match with the master mold and high-temperature curing conditions. Product 1500-1560 can be considered as a candidate for high-temperature room-temperature curing mold silicone, but it must be confirmed through small-scale tests, bubble removal verification, and actual oven baking mold tests.


Why do high-temperature room-temperature curing mold silicas often have bubbles or fail to cure during oven baking or simulation production?


If A/B is not accurately weighed in a 1:1 ratio or is approximately matched by volume ratio, the curing may be incomplete or not occur at all.


If the mixing is insufficient or the mixing direction is inconsistent, a large number of bubbles are introduced into the rubber material. The high-hardness models have a higher viscosity and are difficult to naturally exhaust the air.


If vacuum degassing is not performed, especially for models with a hardness over 20, the bubbles are more difficult to escape, and bubbles or pinholes appear on the mold surface and details.


When pouring the rubber, if it is poured all at once or from a low position, the flow time of the rubber material is insufficient, and the bubbles are encapsulated in the details and corners of the master mold.


If the mold frame uses 502 glue and the glue is not allowed to dry for half an hour or 50°C × 10 minutes before pouring, the 502 glue causes platinum catalyst poisoning and does not cure.


If the rubber material comes into contact with compounds such as tin, phosphorus, ammonium, chlorine, carboxylic acid, thiol, hydroxyl, etc., a poisoning reaction occurs, resulting in local or overall non-curing.


If the surface of the master mold is not cleaned or there are release agents, oil stains, or dust, it affects the wetting of the rubber material and the smoothness of the mold surface.


If the oven temperature rises too quickly or exceeds 250°C, the mold is locally overheated, the shrinkage increases, or the master mold deforms, affecting the dimensional stability.


If the operation time is 30-40 minutes and does not match the pouring and bubble removal cycle, the rubber material has partially gelated before pouring.


When switching from 10:1 mold glue, condensation-type mold glue, or other room-temperature curing mold glues, if the ratio, bubble removal, and pouring process are not re-adjusted, it leads to bubble or curing abnormalities.


If the storage conditions are improper or beyond the shelf life, the activity of the A/B components decreases, affecting the consistency of curing and transparency.


For models with a clear requirement for 250°C high-temperature resistance, long-term stability at 200°C, or low shrinkage, it is not verified based on the actual oven conditions and the structure of the master mold.


First, determine which stage the bubble, non-curing, or deformation problem occurs.


Failure stage Possible reasons Priority inspection direction
There are many bubbles in the mixed rubber material air entrained during mixing, no vacuum, high viscosity mixing method, vacuum degassing, model selection
Bubbles are encapsulated in the details of the master mold after pouring incorrect pouring method, insufficient flow time of the rubber material pouring height, pouring position, rubber material viscosity
There are bubbles or pinholes on the mold surface unclean master mold surface, interference from release agents, insufficient vacuum degassing master mold treatment, compatibility of release agents, degassing process
Local or overall non-curing A/B ratio deviation, 502 glue poisoning, contact with tin, phosphorus, ammonium, chlorine, etc. accuracy of ratio, mold frame glue, source of contamination
Decreased transparency or fogging after curing or fogging impurities mixed in, ratio deviation, improper curing temperature environmental cleanliness, ratio, curing conditions
Deformation or cracking after high-temperature oven baking rapid oven temperature rise, exceeding 250°C, thick rubber layer oven temperature curve, rubber layer thickness, master mold structure
Insufficient tear strength or prone to damage incorrect model selection, insufficient curing, mismatch of anti-tear indicators model hardness, curing conditions, anti-tear requirements
Fluctuations in curing or transparency between batches A/B component activity difference, storage conditions, measurement error inspection during entry, storage records, measurement accuracy
If only the "whether product 1500-1560 was used" is considered without recording the A/B weight ratio, vacuum degassing, pouring method, mold frame glue, oven temperature, and pollution source control, it is usually difficult to accurately determine whether it is a material issue or a process issue.


Why is extending the vacuum degassing time or increasing the oven temperature not necessarily effective?


Product 1500-1560 plays a role in the curing process of the molding system. It is affected by the ratio, degassing, pouring method, mother mold, and oven conditions. Simply extending the vacuum degassing time or increasing the temperature may bring side effects.


Extending the vacuum degassing time can reduce bubbles, but for high-viscosity models, the bubbles escape slowly, and excessive vacuum degassing may lead to the volatilization of low-boiling-point components or the formation of a crust on the surface of the rubber.


Increasing the oven temperature can accelerate the curing process, but above 250°C, it may cause an increase in mold shrinkage, a decrease in transparency, a reduction in tear resistance, or deformation of the mother mold due to heating.


Increasing the total amount of A/B does not change the 1:1 weight ratio requirement. Excessive rubber will not increase strength but will cause waste.


Reducing the viscosity of the rubber can improve degassing, but it may affect the anti-tear strength and detail replication accuracy of the mold.


A deviation in the ratio or after poisoning in the 502 glue can also not allow for normal curing when extending the vacuum degassing time or increasing the temperature.


Improper pouring method causing bubbles, only vacuum degassing cannot completely eliminate the bubbles at the details of the mother mold.


When the mold surface is not cleaned, adjusting the degassing and curing conditions alone cannot solve surface blemishes and poor demolding.


The internal stress and deformation caused by rapid oven heating cannot be eliminated by simply adjusting the final temperature.


After storage has expired or its activity has decreased, only increasing the temperature cannot restore the original curing performance.


Therefore, when optimizing, one should observe the A/B weight ratio, mixing method, vacuum degassing, pouring method, mold frame glue, mother mold treatment, oven temperature curve, and rubber layer thickness, rather than only adjusting a single parameter.


How should different models of product 1500-1560 be selected?


Working conditions IOTA-1500/1505 candidate direction IOTA-1510/1515 candidate direction IOTA-1520/1525 candidate direction IOTA-1530/1540 candidate direction IOTA-1550/1560 candidate direction Still need verification
Ultra-soft high-elastic simulation molds Hardness 0-5±2, elongation ≥ 500% - 550%, suitable for soft simulation Hardness 10-15±2, elongation ≥ 450% - 500% Hardness 20-25±2, elongation ≥ 400% - 420% Hardness 30-40±2, elongation ≥ 330% - 350% Hardness 50-60±2, elongation ≥ 150% - 170% Demolding, detail replication, anti-tear
High tear-resistant and wear-resistant molds Tear resistance ≥ 2 - 4 kN/m, suitable for low-stress mold flipping Teardrop resistance ≥ 12 - 13 kN/m Teardrop resistance ≥ 16 kN/m Teardrop resistance ≥ 17 kN/m, suitable for high-frequency or complex demolding Teardrop resistance ≥ 14 - 15 kN/m Actual tear resistance, fatigue resistance, mold life
Low viscosity easy degassing Viscosity 5000 - 5500 ± 1000, relatively easy to degas Viscosity 6000 - 8000 ± 1000 Viscosity 10000 - 15000 ± 1000 Viscosity 20000 - 22000 ± 1000 Viscosity 25000 - 45000 ± 1000, requires intensified vacuum degassing Vacuum degree, degassing time, bubble residue
High tensile strength requirements Tensile 2.0 - 2.5 MPa Tensile 3.0 - 3.2 MPa Tensile 3.5 - 4.0 MPa Tensile 4.5 MPa, maximum tensile Tensile 4.6 - 4.8 MPa Actual tensile, breaking elongation, modulus
Temperature-resistant 250℃ mold Requires verification of high-temperature dimensional stability and tear retention rate Requires verification Requires verification Requires verification Requires verification Oven temperature curve, adhesive layer thickness, mother mold material
Precise jewelry and fine replication Soft and highly elastic, suitable for detailed demolding General fine replication Higher hardness, dimensional stability High hardness, suitable for large or high-support molds High hardness, suitable for high-support or large items Mother mold details, shrinkage rate, transparency
Do not just choose based on hardness, as there are differences in viscosity, tear resistance, tensile and elongation rates for 10 models. For models with hardness over 20, it is recommended to perform vacuum bubble removal treatment. The final selection depends on the mother mold structure, simulation requirements, demolding difficulty, mold lifespan, oven conditions and bubble removal process.


What are the differences in product 1500-1560 and 10:1 high transparency mold adhesive and similar mold silicone rubber selection?


Comparison direction Product 1500-1560 (1:1 high-temperature resistant mold adhesive) Product 1310-1340 (10:1 high transparency mold adhesive) Condensation type mold silicone rubber General addition-type mold adhesive Selection boundary
Ratio 1:1 weight ratio 10:1 weight ratio Varies by product Varies by product Ratio different, need to re-adjust measurement and mixing process when switching
High temperature Resistant to 250℃, stable for long-term use within 200℃ Unmarked high-temperature mold adhesive General General Preferred this product for oven mold
Transparency Half-transparent High transparency General General to half-transparent High transparency jewelry preferred 1310-1340
Shrinkage rate ≤0.1% Almost no shrinkage Shrinkage large Lower Preferred high-shrinkage models when dimensional stability requirements are high
Hardness range 0-60±2, 10 models 10-40±2, 4 models Varies by product Varies by product Ultra-soft simulation preferred 1500/1505
Tear strength ≥2-17kN/m ≥4-13kN/m General Medium High tear strength models preferred for complex demolding and high-frequency mold flipping
Bubble removal requirements Over 20 hardness requires vacuum High viscosity models require enhanced vacuum bubble removal Lower viscosity easy to bubble removal Medium Choose based on vacuum equipment and mold structure
Platinum catalyst poisoning sensitivity Sensitive to tin, phosphorus, ammonium, chlorine, carboxylic acids, mercaptans, hydroxyl groups and 502 glue Similar sensitivity Does not involve platinum Sensitive to toxins Strict control of mold frame glue and environmental pollution
Operation time 30-40min 60±10min Varies by product Varies by product Choose based on glue pouring and bubble removal rhythm
Applicable scenarios oven mold, high-temperature simulation, precise replication General molds, resin jewelry, fine product replication General molds General molds Choose based on temperature resistance, transparency and resin type
Why is a complete test still necessary even when compatible with the mother mold and oven conditions?


Our company's public information states that product 1500-1560 is used for liquid mold silicone rubber that can be placed in an oven mold, resistant to 250℃ high temperature, stable for long-term use within 200℃, and can be used for making and simulating. However, when used in the actual system, there may still be:


Mother mold material, surface treatment and demolding agent differences.


Frame glue, sealing materials and pollution sources.


A/B weight ratio, mixing method and vacuum bubble removal.


Glue pouring height, pouring position and glue flow time.


Oven heating rate, insulation temperature, time and cooling method.


Adhesive layer thickness, mother mold structure and mold size.


Simulation usage requirements for hardness, rebound and detailed replication.


Environmental cleanliness, dust and fiber pollution.


Storage conditions and activity of A/B components.


Batch-to-batch curing consistency and performance retention rate after high-temperature.


Appearance semi-transparent or short-term curing meets the standard, but cannot prove stability after long-term oven mold, repeated high-temperature or multiple demolding. Before use, verification should be conducted using the complete ratio, actual mother mold and oven conditions.


Which parameters should be confirmed when using product 1500-1560?


Parameter category Required information
Application direction oven baking mold, high-temperature simulation, precision mold, fine product replication
Mother mold type resin, metal, gypsum, wood, 3D printed parts, etc.
Surface treatment Cleaning method, type of release agent, presence of oil and dust
Frame material 502 glue, sealing strip, compatibility of board and silicone
A/B ratio 1:1 weight ratio, measurement accuracy and uniformity of mixing
Mixing method parallel direction mixing, mixing time, avoiding air entrapment
Vacuum blemishing vacuum degree, blemishing time, viscosity and temperature of the adhesive, over 20 hardness suggests vacuum extraction
Pouring adhesive method amount of pouring adhesive, pouring position, natural leveling
Curing conditions room temperature 4-6 hours or oven heating acceleration, temperature not exceeding 250℃
Oven conditions heating rate, holding temperature, time, cooling method
Model selection 1500-1560 and target hardness, tear resistance, viscosity, elongation
Simulation requirements Hardness, rebound, detail replication, dimensional stability
Storage conditions Cold and dry place, sealed, use according to expiration date
Acceptance indicators Bubbles, hardness, tear resistance, tensile strength, elongation rate, shrinkage rate, release performance, performance retention rate after high temperature
What should be mainly verified when using product 1500-1560?


A/B weight ratio measurement accuracy and uniformity of mixing.


Content of bubbles in the mixed adhesive after stirring and vacuum blemishing effect.


Air entrainment and surface blemishes in the mother mold details after pouring adhesive.


Hardness, tear resistance and tensile strength after curing.


Actual performance of elongation rate and shrinkage rate ≤ 0.1%.


Release performance and dimensional stability of the mold and mother mold.


Dimensional stability and tear resistance retention rate of the mold at 250℃.


Hardness and mechanical properties changes after long-term use at 200℃.


Influence of pollution sources such as 502 glue, tin, phosphorus, ammonium, chlorine on curing.


Matching of viscosity with blemishing, pouring adhesive process for different hardness models and blemishing and oven conditions.


Consistency of curing among batches and fluctuation of performance after high temperature.


Activity and curing speed of A/B components after storage.


How to design experiments before using product 1500-1560?


Establish a silicone reference for the current mold, record the model, A/B ratio, blemishing, pouring, curing and oven conditions and failure performance.


Uniform test conditions: mother mold, surface treatment, frame glue, A/B ratio, stirring method, vacuum blemishing, pouring method, curing temperature and time, oven temperature curve.


Set candidate samples: current mold glue, product 1500-1560 of different hardness models, different blemishing and oven conditions gradients.


Complete the full process testing: mixing → vacuum blemishing → pouring → room temperature or oven curing → release → transparency/air bubbles/mechanical property testing → high-temperature mold verification.


Evaluate actual results: bubbles, hardness, tear resistance, tensile strength, elongation rate, shrinkage rate, release performance, performance retention rate after high temperature.


Test items Uniform requirements
Mother mold and surface treatment Keep consistent
Frame glue Keep consistent or set according to test design
A/B ratio 1:1 weight ratio
Stirring and blemishing process Set gradient according to test design
Pouring method Set gradient according to test design
Curing conditions Room temperature or oven according to test design gradient
Oven temperature curve Set gradient according to test design, not exceeding 250℃
Measurement method Uniform air bubbles, hardness, tear resistance, tensile strength, elongation rate, shrinkage rate, release performance, performance retention rate
Under which circumstances should product 1500-1560 not be directly used?


The measurement accuracy of A/B weight ratio cannot be guaranteed or approximate blemishing is made based on volume ratio, resulting in incomplete curing.


After using 502 glue for the mold frame, if the glue was applied without waiting for half an hour or 50℃×10 minutes, it would cause poisoning of the platinum catalyst.
The glue material came into contact with compounds such as tin, phosphorus, ammonium, chlorine, carboxylic acid, thiol, hydroxyl, etc., resulting in non-curing.
Models with a hardness over 20 did not undergo vacuum degassing, and bubbles remained in the details of the mother mold.
The method of applying the glue was improper, and the flow time of the glue was insufficient, causing severe blistering.
The surface of the mother mold was not cleaned or the release agent was incompatible with the room-temperature vulcanization silicone, affecting the release and surface finish.
The oven temperature exceeded 250℃ or the heating rate was too fast, causing the mold to deform, crack or lose performance.
Specific food contact, medical or airworthiness approvals are required, but corresponding materials have not been obtained yet.
Only the application direction is known, but there are no data on the mother mold, ratio, degassing, glue application, oven and simulation requirements.


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