One cannot simply conclude that the product IOTA-800/900 series of condensation type silicone molds (which are 100:2 two-component liquid silicone and have high tensile strength after curing or can be reused for multiple moldings) is suitable for all plaster, cement, POLY-RESIN, PU, AB water, ABS material mold systems. One should first confirm the A/B weight ratio, the type and dosage of the curing agent, the material of the master mold and the mold frame, the compatibility of the release agent, vacuum degassing, the method of releasing the glue, the curing temperature and time, and the hardness requirements of the product. Then, one can determine whether the problem lies in the deviation of the ratio, the evaporation of the curing agent, improper treatment of the master mold, residual bubbles, or an unsuitable match with the resin and the molding conditions. The product IOTA-800/900 series can be considered as a candidate for condensation type mold silicone, but it must be confirmed through small-scale tests, degassing verification, and actual moldings tests.


Why do condensation type mold silicone often have fewer moldings or fail to cure during moldings?


If A/B is not accurately weighed in a 100:2 ratio or is approximately balanced by volume ratio, it leads to incomplete curing, low hardness, or sticky surfaces.


If the curing agent is not thoroughly mixed, there is an excess or insufficient amount in some areas, causing uneven curing, sticky areas, or brittleness.


If the glue is heated immediately after pouring, the curing agent evaporates prematurely, resulting in failure to cure or incomplete curing.


If the surface of the master mold or mold frame is not cleaned, there are oil stains, dust, or residual release agents, which affect the wetting of the glue and the release process, and make the mold prone to tearing during molding.


If the degassing treatment is not carried out, there are residual bubbles in the details of the master mold, and during moldings, the bubble areas become stress concentration points, causing the mold to be prone to damage.


If the pouring method is improper, such as pouring all at once or from a low position, the glue flow time is insufficient, and the glue is heavily adhered.


If the material of the mold frame is not smooth or has poor compatibility with the silicone, the mold will be pulled apart during molding, reducing the number of moldings.


If the mold is removed after less than 8-10 hours of curing, the glue layer has not fully cross-linked, and the tensile strength has not been fully exerted.


When switching from room-temperature curing molds, 10:1 molds, or other condensation type mold silicas, if the ratio, degassing, and curing conditions are not re-adjusted, the mold molding performance may deviate from the target.


Contacting compounds such as tin, phosphorus, ammonium, chlorine, carboxylic acids, thioalcohols, hydroxyl groups, or if the curing agent is damp or expired, it affects the curing quality.


If the storage conditions are improper or beyond the shelf life, the activity of the A/B components decreases, affecting the consistency of curing and the lifespan of moldings.


If there are clear requirements for moldings or tensile strength, but the resin type and molding conditions are not verified according to actual requirements.


First, determine which stage the mold failure or insufficient curing occurs.


Failure stage Possible causes Priority inspection direction
Glue does not cure or is not fully cured after mixing A/B ratio deviation, uncured curing agent, curing agent evaporation or expiration Accuracy of ratio, mixing method, curing agent state
Failure to cure immediately after pouring glue Early curing agent evaporation Heating timing, curing temperature curve
Residual bubbles on mold surface No vacuum degassing, improper pouring method, unclean master mold Degassing process, pouring height, mold cleaning
Bubbles or missing glue in mold details Insufficient glue flow time, high viscosity, complex mold structure Pouring method, glue viscosity, mold exhaust
Mold tearing or few moldings during release Insufficient tensile strength, insufficient curing, improper release agent, rough mold frame Model selection, curing time, release agent, mold frame material
Mold shrinkage or size deviation High curing temperature, thick glue layer, ≤0.3% shrinkage not verified High curing temperature, glue layer thickness, size verification
Mold swelling or corrosion after contact with resin Insufficient solvent resistance, excessive resin heat release, incompatible release agent Resin type, solvent resistance verification, release agent
Batch-to-batch variation in curing or mold replication lifespan A/B component activity differences, storage conditions, measurement errors Incoming inspection, storage records, measurement accuracy
If only the "whether the product IOTA-800/900 series was used" is considered, without recording the A/B weight ratio, curing agent status, bubble removal, pouring method, curing time, and mold handling, it is usually difficult to accurately determine whether it is a material issue or a process issue.


Why is simply increasing the curing agent dosage or raising the curing temperature not necessarily effective?


The IOTA-800/900 series product plays a condensation curing role in the mold replication system. It is affected by the ratio, curing agent status, bubble removal, pouring method, and curing conditions. Simply increasing the curing agent or raising the temperature may bring side effects.


Increasing the dosage of the curing agent may accelerate the curing process, but excessive amounts will cause the mold to be too brittle, with reduced tensile strength, and the number of mold replications to decrease.


Reducing the dosage of the curing agent may result in incomplete curing, a sticky surface, and insufficient mold strength.


Immediately heating after pouring will accelerate the evaporation of the curing agent, causing incomplete curing or inability to cure.


Increasing the curing temperature may shorten the curing time, but it may cause an increase in mold shrinkage, deformation of the mold base, or a decrease in solvent resistance.


Increasing the total dosage of A/B does not change the 100:2 weight ratio requirement. Excessive resin will not increase the mold replication lifespan; instead, it will cause waste.


When not evacuating for bubble removal, only adjusting the curing agent or temperature cannot eliminate the blistering at the mold details.


If the mold surface is not cleaned or the release agent is inappropriate, only adjusting the curing conditions cannot solve the problem of mold tearing.


After the resin has been stored for an extended period or the curing agent has been dampened, only adjusting the ratio cannot restore the original curing performance.


Therefore, when optimizing, one should observe the A/B weight ratio, curing agent status, mixing method, vacuum bubble removal, pouring method, mold handling, curing temperature and time, rather than only adjusting a single parameter.


How should different models of the IOTA-800/900 series be selected?


Working conditions IOTA-800/900 candidate direction IOTA-805/905 candidate direction IOTA-810/910 candidate direction IOTA-815/915 candidate direction IOTA-820/920 candidate direction IOTA-825/925 candidate direction IOTA-830/930 candidate direction Still need verification
Ultra-soft high-elastic simulation molds Hardness 0±2, elongation 580±50%, suitable for soft simulation Hardness 5±2, elongation 550±50% Hardness 10±2, elongation 500±50% Hardness 15±2, elongation 450±50% Hardness 20±2, elongation 420±50% Hardness 25±2, elongation 400±50% Hardness 30-35, elongation 300±50% Deformation resistance, detail replication, tensile strength
High tensile and wear-resistant molds Tensile strength 5±2 kN/m Tensile strength 8±2 kN/m Tensile strength 10±2 kN/m Tensile strength 15±2 kN/m Tensile strength 20±2 kN/m Tensile strength 23±2 kN/m Tensile strength 22±2 kN/m Actual tensile strength, fatigue resistance, mold replications
Low viscosity and easy bubble removal Viscosity 8000-10000 cps Viscosity 8000-10000 cps Viscosity 8000-10000 cps Viscosity 15000±2000 cps Viscosity 20000±2000 cps Viscosity 23000±2000 cps Viscosity 25000±2000 cps Vacuum degree, bubble removal time, bubble residue
High tensile strength requirements 2.03 MPa 2.12 MPa 2.46 MPa 2.56 MPa 2.57 MPa 3.98 MPa (maximum), 2.12 MPa Actual tensile, elongation at break, modulus
Gypsum, cement, POLY-RESIN, PU, AB water, ABS Need to verify chemical resistance and demolding properties Need to verify Need to verify Need to verify Need to verify Need to verify Resin type, heat release temperature, release agent
Oil mud, toys, gifts, relief, Buddha statues, sculptures Soft and highly elastic, suitable for detailed demolding General fine replication General fine replication Higher hardness, stable size High hardness, suitable for large items High hardness, high tear resistance High hardness, high support Mother mold details, shrinkage rate, mold flipping life
Do not only choose based on hardness, as the viscosity, tear resistance, tensile and elongation rates of the 7 models vary. The final choice depends on the mother mold structure, resin type, demolding difficulty, mold flipping times and degassing process.


What are the differences in product selection between the IOTA-800/900 series and the room-temperature curing mold adhesives and similar condensation-type mold adhesives?


Comparison direction Product IOTA-800/900 series (100:2 condensation type) Product 1310-1340 (10:1 room-temperature curing high transparency) Product 1500-1560 (1:1 room-temperature curing high temperature resistance) General condensation-type mold adhesives Selection boundary
Ratio 100:2 weight ratio 10:1 weight ratio 1:1 weight ratio Depending on the product Ratio different, need to re-adjust measurement and mixing process when switching
Curing mechanism Condensation type, curing agent cross-linking Platinum room-temperature curing Platinum room-temperature curing Condensation type Condensation type sensitive to curing agent and moisture, room-temperature curing sensitive to platinum toxic substances
High temperature resistance Resistant to heat, high temperature, corrosion, solvents Not marked high temperature resistant mold Resistant to 250°C, stable at 200°C for a long time General High temperature mold priority 1310-1340
Transparency White/semi-transparent High transparency Translucent General High transparency jewelry priority 1310-1340
Shrinkage rate ≤0.3% Almost no shrinkage ≤0.1% Shrinkage is large High shrinkage stability requirements prioritize room-temperature curing
Mold flipping times Information mentions multiple mold flipping times Need to verify Need to verify General Need to verify according to actual resin and demolding method
Vacuum degassing requirements Need to vacuum degas bubbles High viscosity models need to strengthen vacuum degassing Over 20 hardness recommends vacuum degassing Lower viscosity is easy to degas bubbles Choose according to vacuum equipment and mold structure
Curing agent/catalyst sensitivity Sensitive to curing agent ratio, volatility, moisture absorption Sensitive to tin, phosphorus, ammonium, chlorine, etc. platinum toxic substances Sensitive to tin, phosphorus, ammonium, chlorine, etc. platinum toxic substances Sensitive to curing agent Strictly manage ratio and pollution sources according to the system
Operation time 15-25 minutes 60±10 minutes 30-40 minutes Depending on the product Choose based on the pouring and degassing rhythm
Applicable scenarios Gypsum, cement, POLY-RESIN, PU, AB water, ABS molds High precision molds, resin jewelry, fine product replication Room-temperature curing molds, high-temperature simulation General molds Choose based on resin type, temperature resistance and transparency
Why is it still necessary to conduct complete tests when compatibility with the mother mold and curing agent is ensured?


Our company's public information uses the IOTA-800/900 series product as the elastic mold material for pouring gypsum, cement, POLY-RESIN, PU, AB water, ABS materials, as well as the production and replication of oil mud, toys, gifts, relief, Buddha statues, urban sculptures, cement products, hand boards, car models, household appliance models, soap molds, etc. However, when used in actual systems, there may still be:


Material and surface treatment differences of the master mold.
Frame material, smoothness and sealing material.
A/B weight ratio, curing agent type and status.
Mixing method, vacuum degassing and glue pouring method.
Curing temperature, time and glue layer thickness.
Resin type, heat release temperature and compatibility of the release agent.
Number of mold flipping, flipping method and mold lifespan.
Environmental cleanliness, dust and fiber contamination.
Storage conditions and the activity of A/B components.
Consistency of curing among batches and flipping performance.
Uniform appearance or short-term curing compliance, which cannot prove long-term flipping, resistance to resin heat release or stability after repeated degassing. Verification should be conducted using a complete ratio, actual master mold and resin conditions before use.
Which parameters should be confirmed when using the IOTA-800/900 series products?


Parameter category Required information
Application direction Gypsum, cement, POLY-RESIN, PU, AB water, ABS molds, oil clay, toys, gifts, relief, Buddha statues, sculptures, etc.
Master mold type Oil clay, resin, gypsum, wood, 3D printed parts, etc.
Surface treatment Cleaning method, release agent type, presence of oil and dust
Frame material Ackrylic board and other smooth materials, compatibility of sealing materials and silicone
A/B ratio 100:2 weight ratio, measurement accuracy and mixing uniformity
Curing agent status Type, whether damp, whether expired, mixing uniformity
Mixing method Same direction mixing, mixing time, avoiding air entrapment
Vacuum degassing Vacuum degree, degassing time, viscosity and temperature of the glue material
Pouring glue method Pouring height, pouring position, natural leveling
Curing conditions 8-10 hours at room temperature or 6-8 hours, whether heating and heating timing
Model selection 800/900 to 830/930 and target hardness, tear resistance, viscosity, elongation
Resin type Gypsum, cement, POLY-RESIN, PU, AB water, ABS
Storage conditions Cold and dry, sealed, use according to expiration date
Acceptance indicators Bubbles, hardness, tear resistance, tensile strength, elongation rate, shrinkage rate, release performance, flipping times
What should be focused on verifying when using the IOTA-800/900 series products?


Accuracy of A/B weight ratio measurement and mixing agent uniformity.


Content of bubbles in the glue after mixing and effect of vacuum degassing.


Air entrainment and surface blemishes in the details of the master mold after pouring.


Hardness, tear strength and tensile strength after curing.


Actual performance of elongation rate and shrinkage rate ≤ 0.3%.


Release performance between the mold and the master mold and dimensional stability.


Chemical resistance and release performance after pouring gypsum, cement, POLY-RESIN, PU, AB water, ABS.


Flipping times and mold tearing, wear.


Impact of damp curing agent, expired curing agent or immediate heating after pouring glue on curing.


Matching of viscosity with degassing and pouring glue processes for different hardness models.


Consistency of curing among batches and flipping performance fluctuations.


Activity of A/B components after storage and curing speed.


How to design experiments before using the IOTA-800/900 series products?


Establish a silicone reference for the current mold, record the model, A/B ratio, curing agent status, degassing, pouring glue and curing conditions, and failure manifestations.


Uniform test conditions: master mold, surface treatment, frame material, A/B ratio, mixing method, vacuum degassing, pouring glue method, curing temperature and time.


Set candidate samples: current mold glue, IOTA-800/900 series different hardness models, different degassing and curing conditions gradients.


Complete the entire process testing: mixing → degassing → pouring glue → curing → release → transparency/air bubbles/mechanical properties testing → flipping verification.


Evaluation of actual results: bubbles, hardness, tear resistance, tensile strength, elongation, shrinkage rate, demolding property, number of demolding cycles.


Test items Uniform requirements
Mother mold and surface treatment Consistent
Frame material Consistent or set according to the test design
A/B ratio 100:2 weight ratio
State of curing agent Consistent, record moisture absorption and expiration situations
Mixing and bubble removal process Set gradient according to the test design
Pouring adhesive method Set gradient according to the test design
Curing conditions Set gradient according to the test design to avoid immediate heating after pouring adhesive
Measurement methods Consistent for bubbles, hardness, tear resistance, tensile strength, elongation, shrinkage rate, demolding property, and number of demolding cycles
Which situations are not suitable for directly using the product IOTA-800/900 series?


The accuracy of A/B weight ratio measurement cannot be guaranteed or an approximate ratio based on volume is used, resulting in incomplete curing.


The curing agent is damp, expired, or the mixing is not uniform, leading to poor curing or local stickiness.


Heating immediately after pouring adhesive accelerates curing, resulting in the volatilization of the curing agent and inability to cure.


No vacuum bubble removal was performed, and the mother mold